PCB Final Manufacturing Checklist

  1. Hole diameter on drawing are finished sizes, after plating. Finished hole sizes are >=10 mils larger than lead Silkscreen legend text weight >=10 mils
  2. Pads >=15 mils larger than finished hole sizes
  3. Place through-hole components on 50 mil grid
  4. No silkscreen legend text over vias (if vias not soldermasked) or holes
  5. All legend text reads in one or two directions
  6. Components labeled left-right, top-bottom
  7. Company logo in silkscreen legend, company logo in foil, copyright notice on PCB, date code on PCB, PCB part number
  8. Assembly part number on PCB, for assembled boards
  9. Components >=0.2” from edge of PCB
  10. Ground planes where possible
  11. Test pad or test via on every net to allow in circuit test
  12. Test pads 200 mils from edge of board
  13. All polarized components checked
  14. No acute inside angles in foil
  15. Traces >= 20 mils from edge of PCB
  16. PCB revision on silkscreen legend
  17. Mounting holes matched 1:1 with mating parts
  18. Automated netlist check
  19. Manual netlist check
  20. Check netlist for nodes with only one connection
  21. CAD design rule check
  22. Tools on drill plot and NC drill file cross checked
  23. Soldermask over bare copper noted if needed
  24. PCB thickness, material, copper weight noted
  25. Trace width sufficient for current carried
  26. Minimum component body spacing
  27. SMD pad shapes checked
  28. Visual references for automated assembly
  29. Tooling holes for automated assembly
  30. Sufficient clearance for high voltage traces
  31. Component and trace keepout areas observed
  32. High frequency circuitry precautions observed
  33. Thermal relief pads for internal power layers
  34. Blind and buried vias only allowed on multilayer PCB
  35. Sufficient clearance for socketed ICs
  36. SMD component orientation arbitrary or consistent
  37. Ensure pin 1 interpretation and orientation consistent among all connectors of a given type on the board
  38. Standoffs on power resistors or other hot components
  39. Digital and analog signal commons joined at only one point
  40. EMI and RFI filtering as close as possible to exit and entry points in shielded areas
  41. Layout PCB so that any rework or repair of a component does not require removal of other components
  42. Extra connector and IC pins accessible on prototype boards, just in case
  43. Check all power and ground connections to ICs
  44. Provide ground test points, accessible and sized for scope ground clip
  45. Potentiometers should increase controlled quantity clockwise
  46. Bypass capacitors located close to IC power pins
  47. All silkscreen text located to be readable when the board is populated
  48. All ICs have pin one clearly marked, visible even when chip is installed
  49. High pin count ICs and connectors have corner pins numbered for ease of location
  50. Silk screen tick marks for every 5th or 10th pin on high pin count ICs and connectors
  51. Check for traces running under noisy or sensitive components
  52. Check IC pin count on layout vs. schematic
  53. No vias under metal-film resistors and similar poorly insulated parts
  54. Check for traces which may be susceptible to solder bridging due to low clearances Maximize distances between features where possible
  55. Check for dead-end traces
  56. Check for power not shorted to ground
  57. Provide multiple vias for high current and/or low impedance traces